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User's Manual
SE-17012
System Evaluation Board
Target Devices PD17012 PD17P012
Document No. U15580EJ2V0UM00 (2nd edition) (O. D. No. EEU-1462) Date Published August 2001 N CP(K)
1992, 2001 (c) Printed in Japan
[MEMO]
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User's Manual U15580EJ2V0UM
SIMPLEHOST is a registered trademark of NEC Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation.
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* The information in this document is current as of May, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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User's Manual U15580EJ2V0UM
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify:
* * * * *
Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements
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In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country.
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J01.2
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Major Revisions in This Edition
Page Throughout p.40 p.41 p.43 p.45 p.48 p.49 p.50 Description Addition of descriptions of probes, conversion cables, and conversion sockets corresponding to the 80-pin plastic QFP package that is added. Addition of pin numbers of 80-pin plastic QFP package in Table 5-1 J1 Connector Pin Table. Addition of pin numbers of 80-pin plastic QFP package in Table 5-2 J2 Connector Pin Table. Addition of Figure 6-2 Package Drawing of EP-17K80GC. Addition of Figure 6-4 Package Drawing of 80GC Conversion Cable. Addition of Figure 6-7 Package Drawing of EV-9200GC-80. Addition of Figure 6-8 Recommended Pattern for Mounting Board of EV-9200GC-80. Addition of APPENDIX REVISION HISTORY.
The mark
shows major revised points.
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User's Manual U15580EJ2V0UM
PREFACE
Readers
This manual is intended for users who are performing system evaluation of the PD17012 using the SE-17012.
Purpose
This manual is intended to give users a thorough understanding of the functions and usage of the SE-17012, which is the system evaluation board for the PD17012.
Organization
This manual is organized broadly as follows. * Outline * Specifications * Block diagram * Usage * Connector pin table * Emulation probe, conversion cable and conversion socket package information
Conventions
Note: Footnote for items marked with Note in the text Caution: Information requiring particular attention Remark: Supplementary information
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CONTENTS CHAPTER 1 OUTLINE..............................................................................................................................12 CHAPTER 2 SPECIFICATIONS ...............................................................................................................13 CHAPTER 3 BLOCK DIAGRAM .............................................................................................................15 CHAPTER 4 USAGE.................................................................................................................................16 4.1 Connection to Target System ....................................................................................................16 4.2 Level Conversion Chip (PD6706GF) ........................................................................................17
4.2.1 4.2.2 Overview..........................................................................................................................................17 Using the level conversion chip .......................................................................................................17 Jumper switch for selecting power supply to SE board (JS1)..........................................................17 Power supply pins............................................................................................................................19 Application examples.......................................................................................................................20 Changing oscillation frequency........................................................................................................24 Fine adjustment of oscillation frequency .........................................................................................24 Reset switch (SW1) .........................................................................................................................25 Slide switch for PD27C256AD/PD27C512D, 27C1001AD (SW2) ...............................................25 Slide switch for ROM/RAM (SW3) ...................................................................................................25 DIP switch for POC0 to POC3 pull-up resistor setting (DSW1).........................................................26 Power LED (LED1) ..........................................................................................................................26 Installing and removing the SE board..............................................................................................27 Power Supplies................................................................................................................................28 Transfer of ICE file to in-circuit emulator .........................................................................................29 Error messages and corresponding action ......................................................................................30 Precautions......................................................................................................................................31 Mounting of PROM ..........................................................................................................................32 Setting of ROM/RAM selection slide switch (SW3)..........................................................................33 Setting of PD27C256AD, PD27C512D, 27C1001AD selection slide switch (SW2).....................34 Supply of power ...............................................................................................................................34 Program execution...........................................................................................................................35
4.3
SE Board Power Supplies ..........................................................................................................17
4.3.1 4.3.2 4.3.3
4.4
Oscillation Frequency.................................................................................................................24
4.4.1 4.4.2
4.5
Other Switches ............................................................................................................................25
4.5.1 4.5.2 4.5.3 4.5.4 4.5.5
4.6
Use with In-Circuit Emulator ......................................................................................................27
4.6.1 4.6.2 4.6.3 4.6.4 4.6.5
4.7
Use of SE Board as Single Unit .................................................................................................32
4.7.1 4.7.2 4.7.3 4.7.4 4.7.5
4.8 4.9
Monitor Pins.................................................................................................................................36 Setting at Shipment.....................................................................................................................38
CHAPTER 5 CONNECTOR PIN TABLE ................................................................................................40
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User's Manual U15580EJ2V0UM
CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET ..........................................................................................42 6.1 Package Drawing of Emulation Probe ......................................................................................42 6.2 Package Drawing of Conversion Cable ....................................................................................44 6.3 Package Drawing of Conversion Socket and Recommended Pattern for Board Mounting ...46 APPENDIX REVISION HISTORY .............................................................................................................50
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LIST OF FIGURES
Figure No. 2-1 3-1 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 4-13 4-14 4-15 4-16 4-17 4-18 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 Title Page
SE-17012 Parts Layout ...............................................................................................................................14 SE-17012 Block Diagram............................................................................................................................15 Connection to Target System......................................................................................................................16 Power Supply Method When Used Mounted on In-Circuit Emulator and VDD1/VDD2 = VCC = +5 V..............20 Power Supply Method When SE Board Is Used Mounted on In-Circuit Emulator and VDD1/VDD2 Is Supplied from CN12 ................................................................................................................................21 Power Supply Method When SE Board Is Used Mounted on In-Circuit Emulator and VDD1/VDD2 Is Supplied from Emulation Probe...............................................................................................................21 Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 = VCC = +5 V .....................22 Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 Is Supplied from CN12......23 Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 Is Supplied from Emulation Probe .................................................................................................................................23 Parts Board Configuration...........................................................................................................................24 Fine-Tuning User Clock Oscillation Frequency...........................................................................................24 Slide Switch for ROM/RAM (SW3) ..............................................................................................................25 DIP Switch for POC0 to POC3 Pull-Up Resistor Setting (DSW1) ................................................................26 External View of In-Circuit Emulator (with Outer Lid Opened) ....................................................................27 Mounting and Removal of SE-17012 ..........................................................................................................28 Notes for Mounting PROM ..........................................................................................................................33 ROM/RAM Selection Slide Switch (SW3) ...................................................................................................33 Setting of PD27C256AD/PD27C512D, 27C1001AD Selection Slide Switch (SW2) ...............................34 Example of Connection When SE-17012 Is Used as Single Unit ...............................................................35 Layout of Monitor Pins ................................................................................................................................37 Package Drawing of EP-17202GF ..............................................................................................................42 Package Drawing of EP-17K80GC .............................................................................................................43 Package Drawing of 64GF Conversion Cable.............................................................................................44 Package Drawing of 80GC Conversion Cable ............................................................................................45 Package Drawing of EV-9200G-64 .............................................................................................................46 Recommended Pattern for Mounting Board of EV-9200G-64.....................................................................47 Package Drawing of EV-9200GC-80...........................................................................................................48 Recommended Pattern for Mounting Board of EV-9200GC-80 ..................................................................49
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User's Manual U15580EJ2V0UM
LIST OF TABLES
Table No.
1-1 4-1 4-2 4-3 4-4 4-5 4-6 5-1 5-2
Title
Page
SE-17012 Development Tool Correspondence Table ................................................................................ 12 JS1 Functions for SE Board Used with In-Circuit Emulator ........................................................................ 18 JS1 Functions for SE Board Used as Single Unit ....................................................................................... 18 Power Supply Pins...................................................................................................................................... 19 Device No. and SE Board No. .................................................................................................................... 30 Monitor Pin Names and Functions.............................................................................................................. 36 Setting of Jumper Switches and Slide Switches ......................................................................................... 39 J1 Connector Pin Table .............................................................................................................................. 40 J2 Connector Pin Table .............................................................................................................................. 41
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CHAPTER 1 OUTLINE
The SE-17012 is the system evaluation board (SE board) for the 4-bit single-chip microcontroller PD17012. Although the SE-17012 can be used as a single unit, program debugging can be performed more efficiently when it is used mounted on the IE-17K or IE-17K-ET to those of the PD17012. When connecting the SE-17012 to the target system, a combination of the 64GF conversion cable (provided) and the EP-17202GF (64-pin plastic QFP probe) (sold separately), or the 80GC conversion cable (provided) and the EP17K80GC (80-pin plastic QFP probe) (sold separately) is used. A level conversion chip built into the SE-17012 enables the evaluation of the PD17012 chip over a range of +4.5 V to +5.5 V, not just at the nominal +5 V. Note Economical version: External power supply type Table 1-1. SE-17012 Development Tool Correspondence Table
SE Board Method of Use Assembler (AS17K) Output File (Host Machine) ICE fileNote 1 PC-9800 series IBM PC/ATTM PRO fileNote 2 PC-9800 series IBM PC/AT In-Circuit Emulator Supported SoftwareNote 3 Emulation Probe Evaluation Target Product
Note
, which are the 17K Series common in-circuit emulators.
The PD17012 is used as the interface with the target system. Therefore, the functions of the SE-17012 are equal
SE-17012
When used in conjunction with in-circuit emulator When SE17012 is used as a single unit
IE-17K IE-17K-ET
SIMPLEHOST
EP-17202GF EP-17K80GC
PD17012GF PD17012GC
Not necessary
Not necessary
Notes 1. ICE file: File that is automatically output after the source program is assembled. 2. PRO file: File output when the assembler option (/PRO) is specified during assembly of the source program. For details of the ICE and PRO file formats, see the AS17K User's Manual. 3. SIMPLEHOST is Windows -based debugger software for the in-circuit emulator. The man-machine interface uses a mouse for browsing the source code listings and tables on the screen. For further details, see the SIMPLEHOST User's Manual. Note that any other commercial RS-232C communications program may be substituted, but doing so requires knowledge of baud-rate settings and in-circuit emulator commands. For further details, see the IE-17K or IE-17K-ET User's Manual.
TM
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User's Manual U15580EJ2V0UM
CHAPTER 2 SPECIFICATIONS
Part number Program memory
SE-17012 * When used mounted on the in-circuit emulator, use the PD43256AGU. * When used as a single unit, use the PD27C256AD, 27C512D, or 27C1001AD with a program written, mounted on the SE-17012.
Data memory Oscillation frequency Instruction cycle Operating temperature Storage temperature Power supply
The memory (316 x 4 bits) incorporated in the PD17012 is used. 4.5 MHz 4.4 s (when a 4.5 MHz crystal resonator is used) +10 to +40C -10 to +50C (no condensation) * PD17012 power supply (VDD): +4.5 to 5.5 V Supplied via the emulation probe (EP-17202GF) or CN12. * SE-17012 power supply (VCC): +5 V 5% Supplied by the in-circuit emulator when the SE-17012 is used mounted on the incircuit emulator. Supplied via CN11 when the SE-17012 is used as a single unit.
Current consumption
110 mA max. (When the PD27C256AD is used as the program memory without load)
External dimensions
150 x 175 x 33 mm
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CHAPTER 2 SPECIFICATIONS
Figure 2-1. SE-17012 Parts Layout
AC1
SW1 (Reset switch)
U5
PD17012GF
(Slave)
U6
CH20
CH21
PD6706GF
JS4 CH1 CH2 CH3 CH4 LED1 CH5 CH6 CH7 CH8 CH9 CH12 CH15 CH16
CN11
U1
U8
PD17012GF
(Master) Mam' Chip (Gate array)
CH13
CH11
CH14
CH10
CH17
CH18
CH19
512 JS3 U13
1M
DSW1
J2
U14
PD43256AGU
JS1
J1 SW3 SW2 CN12
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User's Manual U15580EJ2V0UM
CHAPTER 3 BLOCK DIAGRAM
Figure 3-1. SE-17012 Block Diagram
Connector to conversion cable J1 CE VDD J2 CN12 12
P0A, P0B, P0C, P0D P1A, P1B, INT, LCD, COM AI bus
P1C, P1D
PD17012GF
(Master) CE XOUT XIN
D bus J CKOUT XOUT XIN
PD17012GF
(Slave) CE
VDD1 (VDD2) system
Booster
JS1
Synchronous processing signal
5V system Level conversion chip
Clock switching circuit VDD Reset switch RES0 Mam' Chip (Gate array)
8 MHz User clock
Overcurrent prevention
LED
Program memory
Trace bus Supervisor bus Coverage bus 1 CN7 CN8 Connector to in-circuit emulator memory board CN9 2
CN11
VCC
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VDD1 (VDD2)
CHAPTER 4 USAGE
4.1 Connection to Target System
Connect the SE-17012 to the target system with the conversion cable provided and the emulation probe (EP17202GF or EP-17K80GC) (sold separately) as shown in Figure 4-1. Figure 4-1. Connection to Target System
SE board (SE-17012)
Target system
Conversion cable
Emulation probe (EP-17202GF or EP-17K80GC)
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User's Manual U15580EJ2V0UM
CHAPTER 4 USAGE
4.2 Level Conversion Chip (PD6706GF)
4.2.1 Overview The level conversion chip enables connection of the SE board with an operating voltage, VCC, of +5 V to a target system with a different operating voltage, VDD1/VDD2, by converting signal levels in both directions so that both sides can communicate effectively. Remarks 1. VDD1/VDD2 is the operating voltage of the target system. The SE board enables connection of this voltage to the PD17012 chip via the emulation probe or CN12 for debugging under the actual operating conditions of the target system. 2. VCC is the power supply for all parts of the SE board except the PD17012 chip. It must be +5 V. The SE board automatically takes its power from the in-circuit emulator when mounted, but requires a power supply connection to CN11 when used as a single unit. 4.2.2 Using the level conversion chip * Set the JS1 jumper switch to the VDD side. * The level conversion chip then automatically converts signal levels in both directions between the SE board and the target if a voltage other than +5 V is supplied from the emulation probe or CN12.
4.3 SE Board Power Supplies
The SE board requires two power supplies: VCC, the power supply for all parts of the SE board except the
PD17012 chip, and VDD1/VDD2, the power supply for the PD17012 chip. VCC must be +5 V. VDD1/VDD2 can be
anywhere in the range supported by the PD17012 chip: +4.5 V to +5.5 V. Note that VDD1 and VDD2 are connected on the SE board. 4.3.1 Jumper switch for selecting power supply to SE board (JS1) The JS1 jumper switch setting determines which power supply is supplied to the PD17012 chip: the power supply supplied to the SE board (+5 V), or the power supply applied from the emulation probe or CN12. If the target system uses a +5 V power supply voltage, setting the JS1 jumper switch to the VDD side eliminates the need for a separate +5 V power supply because the PD17012 chip then automatically draws power from the incircuit emulator when it is mounted on the SE board. A power supply of +5 V must be supplied from CN11, however, when the PD17012 chip is used as a single unit. If, on the other hand, the target system uses a power supply voltage of other than +5 V, setting the JS1 jumper switch to the VDD1 side connects the PD17012 chip to that voltage, as supplied via the emulation probe or CN12, for debugging under the actual operating conditions of the target system. Tables 4-1 and 4-2 summarize the JS1 jumper switch setting functions. Caution The supply voltage for the PD17012 chip must be +4.5 to +5.5 V.
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CHAPTER 4 USAGE
Table 4-1. JS1 Functions for SE Board Used with In-Circuit Emulator
Power Supply JS1 Setting Power Supply for PD17012 Chip (VDD1/VDD2) +5 V power supply from incircuit emulator Power Supply for Other Parts of SE Board (VCC) +5 V power supply from incircuit emulator
+5 V
JS1
VDD1
+5 V
JS1
Target system power supply from emulation probe or CN12
VDD1
Remark
The shaded area indicates the selected switch position. Table 4-2. JS1 Functions for SE Board Used as Single Unit
Power Supply Power Supply for PD17012 Chip (VDD1/VDD2) +5 V power supply from CN11
+5 V
JS1 Setting
Power Supply for Other Parts of SE Board (VCC) +5 V power supply from CN11
JS1
VDD1
+5 V
JS1
Target system power supply from emulation probe or CN12
VDD1
Remark
The shaded area indicates the selected switch position.
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User's Manual U15580EJ2V0UM
CHAPTER 4 USAGE
4.3.2 Power supply pins The SE board provides three pins for connecting external power supplies, which must be used in accordance with the evaluation environment. These pins are described in Table 4-3. Table 4-3. Power Supply Pins
Pin CN11 Power Supply Name (Range) VCC (+5 V 5%) Function Power supply for all parts of the SE board except the PD17012 chip. Must be +5 V. Only use when the SE board is used as a single unit. Do not use when the SE board is mounted on the in-circuit emulator, as power is then automatically supplied from the in-circuit emulator. Chip power supply from a target system power supply of other than +5 V. (Range: +4.5 to 5.5 V) To use, set the JS1 jumper switch to the VDD1 side. Equivalent to CN12 since the emulation probe power supply pin and CN12 are connected on the SE board. VDD1 and VDD2 are also connected on the SE board.
CN12
VDD1, VDD2 (+4.5 to +5.5 V)
Emulation probe (VDD1/VDD2 and GND pins)
VDD1, VDD2 (+4.5 to +5.5 V)
Remark
CN11 consists of 2 pins: a ground pin (pin 1) and a power supply pin (pin 2). The cable supplied with the product is the most convenient means of connecting these power supplies.
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CHAPTER 4 USAGE
4.3.3 Application examples (1) When used mounted on in-circuit emulator (a) When used mounted on in-circuit emulator and VDD1/VDD2 = VCC = +5 V Set the JS1 jumper switch to the VCC side to connect all power supplies (VCC and VDD1/VDD2) to the in-circuit emulator's +5 V power supply. Make sure that there is no power supplied from CN11. Power supply from the emulation probe (EP-17202GF) or CN12 is not necessary. Figure 4-2. Power Supply Method When Used Mounted on In-Circuit Emulator and VDD1/VDD2 = VCC = +5 V
SE board Target system Power supply (VDD) CN11
+5 V VDD1 JS1
CN12
Note Including provided conversion cable. Caution Remark Do not supply power from CN11. Power supply from CN12 is not necessary.
JS1
Emulation probeNote
VCC +5 V VDD Supply from in-circuit emulator
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User's Manual U15580EJ2V0UM
CHAPTER 4 USAGE
(b) When used mounted on in-circuit emulator and VDD1/VDD2 VCC, VCC = +5 V Set the JS1 jumper switch to the VDD1 side to connect VCC to the in-circuit emulator's +5 V power supply and the PD17012 chip to the power supply from the emulation probe or CN12. Figure 4-3. Power Supply Method When SE Board Is Used Mounted on In-Circuit Emulator and VDD1/VDD2 Is Supplied from CN12
SE board Target system Power supply (VDD) CN11
+5 V VDD1 JS1
CN12
Figure 4-4. Power Supply Method When SE Board Is Used Mounted on In-Circuit Emulator and VDD1/VDD2 Is Supplied from Emulation Probe
SE board Target system Power supply (VDD) CN11
+5 V VDD1 JS1
CN12
Note Including provided conversion cable. Caution Remark Do not supply power from CN11. Power supply from CN12 is not necessary.
JS1 JS1
Emulation probeNote
VCC +5 V Supply from in-circuit emulator
Emulation probeNote
VCC +5 V Supply from in-circuit emulator
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CHAPTER 4 USAGE
(2) When SE board is used as single unit (a) When SE board is used as a single unit and VDD1/VDD2 = VCC = +5 V Set the JS1 jumper switch to the +5 V side to connect all power supplies (VCC and VDD1/VDD2) to CN11. Figure 4-5. Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 = VCC = +5 V
+5 V
VCC VDD SE board Target system Power supply (VDD) CN11
+5 V VDD1 JS1
CN12
Note Including provided conversion cable. Remark Power supply from CN12 and the emulation probe is not necessary.
JS1
Emulation probeNote
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User's Manual U15580EJ2V0UM
CHAPTER 4 USAGE
(b) When SE board is used as a single unit and VDD1/VDD2 VCC, VCC = +5 V Set the JS1 jumper switch to the VDD1 side. VCC and VDD1/VDD2 are supplied from CN11 and CN12 or the emulation probe, respectively. Figure 4-6. Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 Is Supplied from CN12
+5 V VCC
SE board
Target system Power supply (VDD)
CN11
+5 V VDD1 JS1
CN12
Figure 4-7. Power Supply Method When SE Board Is Used as Single Unit and VDD1/VDD2 Is Supplied from Emulation Probe
+5 V VCC
+5 V VDD1 JS1
CN12
Note Including provided conversion cable. Remark Power supply from CN12 is not necessary.
JS1 JS1
Emulation probeNote
SE board
Target system Power supply (VDD)
CN11
Emulation probeNote
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CHAPTER 4 USAGE
4.4 Oscillation Frequency
4.4.1 Changing oscillation frequency The main clock is fixed at 8 MHz, but the user frequency of 4.5 MHz may be changed by replacing the resonator attached to the parts board (see Figure 4-8). Figure 4-8. Parts Board Configuration
Capacitor (33 pF)
Crystal resonator
Trimmer capacitor (30 pF) Resistor (1 M)
4.4.2 Fine adjustment of oscillation frequency The oscillator frequencies for the main and user clocks at the time of shipment are 8 MHz 20 ppm and 4.5 MHz 20 ppm, respectively. The trimmer capacitor shown in Figure 4-9 is for fine-tuning the user clock frequency. Waveform monitoring or frequency measurement can be performed using the monitor pin CH21. Figure 4-9. Fine-Tuning User Clock Oscillation Frequency
AC1 Screwdriver
PD17012GF
(Slave)
CH21
Trimmer capacitor
PD17012GF
(Master) Mam'Chip (Gate array)
Frequency counter
J2 J1
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User's Manual U15580EJ2V0UM
CHAPTER 4 USAGE
4.5 Other Switches
4.5.1 Reset switch (SW1) The SW1 switch is for resetting the SE board when it is used as a single unit. For further details on using the SE board as a single unit, see 4.7 Use of SE Board as Single Unit. 4.5.2 Slide switch for PD27C256AD/PD27C512D, 27C1001AD (SW2) The SW2 switch specifies the type of program memory used when the SE board is used as a single unit:
PD27C256AD/PD27C512D or 27C1001AD. For further details on using the SE board as a single unit, see 4.7 Use
of SE Board as Single Unit. 4.5.3 Slide switch for ROM/RAM (SW3) Figure 4-10. Slide Switch for ROM/RAM (SW3) (a) When used mounted on IE-17K or IE-17K-ET
ROM SW3 RAM
(b) When the SE board is used as a single unit
ROM SW3 RAM
Remark
The shaded area indicates the selected switch position.
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CHAPTER 4 USAGE
4.5.4 DIP switch for POC0 to POC3 pull-up resistor setting (DSW1) The DSW1 set of DIP switches controls the use of pull-up resistors on pins POC0 to POC3. Setting a switch to the ON position pulls up the corresponding pin. Figure 4-11. DIP Switch for POC0 to POC3 Pull-Up Resistor Setting (DSW1)
1 2 3 4
- OFF -
4.5.5 Power LED (LED1) This LED lights when the VCC power supply to the SE board is normal. For further details, see 4.6 Use with InCircuit Emulator and 4.7 Use of SE Board as Single Unit.
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4.6 Use with In-Circuit Emulator
4.6.1 Installing and removing the SE board Use the following procedure to install the SE-17012 in the in-circuit emulator. (1) Remove the outer and inner covers from the in-circuit emulator. (2) Insert the three connectors (CN7, CN8, and CN9) on the underside of the SE-17012 into the matching connectors provided on top of the memory board inside the in-circuit emulator. (3) To prepare for connection to the target system, connect the conversion cable to the SE-17012 connectors J1 and J2 and then connect the emulation probe (EP-17202GF) to the cable. (4) Replace the outer and inner covers on the in-circuit emulator. To remove the SE-17012 from the in-circuit emulator, simply reverse the above procedure. Take special care, however, not to exert sideways force when separating the SE-17012 and memory board connectors. Figure 4-12. External View of In-Circuit Emulator (with Outer Cover Opened)
Outer cover
Inner cover
IE-17K
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CHAPTER 4 USAGE
Figure 4-13. Mounting and Removal of SE-17012
Connector (Female) SE board Connector (Male)
Memory board Spacer
4.6.2 Power Supplies If the target system uses a power supply voltage other than +5 V, this voltage may be supplied to the PD17012 chip on the SE board via the emulation probe or CN12. For further details, see the descriptions of the PD6706GF level conversion chip and SE board power supply connections in 4.2 Level Conversion Chip (PD6706GF) and 4.3 SE Board Power Supplies, respectively. Before replacing the inner and outer covers of the in-circuit emulator after mounting the SE-17012, turn the power supply to the in-circuit emulator on and confirm that the LED on the SE-17012 lights. If it does not light, the following causes can be considered. * The power cord of the in-circuit emulator is not connected. * An overcurrent (more than about 500 mA) is flowing to the SE-17012. * The SE-17012 has not been properly installed. If the LED does not light, turn off the power supply to the in-circuit emulator and reinstall the SE-17012. Thereafter, if the LED still does not light even when the power supply is turned on again, the LED is considered to be defective. In this case, contact an NEC sales office or representative.
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4.6.3 Transfer of ICE file to in-circuit emulator The in-circuit emulator (IE-17K, IE-17K-ET) is used to debug the hardware and software of a target system by connecting to a host machine such as the PC-9800 series. For the operation of the in-circuit emulator, see the user's manual for the IE-17K or IE-17K-ET. With SIMPLEHOST, the source code listings automatically appear on the screen if the SE-17012 is properly installed in the in-circuit emulator. For details of SIMPLEHOST, see the SIMPLEHOST User's Manual. commercial RS-232C communications program, use the following procedure to check the connection. (1) Turn on the power to the in-circuit emulator. If it is already on, press the in-circuit emulator RESET switch to restart it and display the command prompt (@@@>). (2) Use the .LP command to load the ICE file (with the extension ICE) of the PD17012 program created by the AS17K assembler or the ICE file output via the .SP command to the in-circuit emulator. The in-circuit emulator does not function until the load is complete. If the SE-17012 is properly installed, the incircuit emulator then displays the following messages followed by the BRK> prompt. At this point, the IE-17K or IE17K-ET becomes the PD17012 in-circuit emulator. OK D17012 BRK> If the above message is not displayed, the following causes can be considered. * The ICE file is not compatible with the PD17012 chip on the SE-17012. * An SE board other than SE-17012 has been mounted. * An ICE file of other than the PD17012 has been loaded. * The option switch settings differ from those stored in the program memory. * The SE-17012 has been improperly mounted on the in-circuit emulator. For a
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CHAPTER 4 USAGE
4.6.4 Error messages and corresponding action The in-circuit emulator and SE-17012 have the function to display an error message if the mounted PD17012 chip and the loaded ICE file are erroneously combined. Furthermore, to assure more positive debugging, an SE board number has been assigned to the SE-17012 and a device number to the PD17012GF-xxx-3BE or PD17012GC-xxx-8BT. The device number, SE board number and actions in response to error messages are described below. Table 4-4. Device No. and SE Board No. Evaluation Device Device No. 3A SE Board No. 3A
PD17012
Remarks 1. The device number is a registered number assigned to the chip. 2. The SE board number is a registered number assigned to the SE board. 3. The device number and SE board number are contained in data in the ICE file to be loaded and are used by the in-circuit emulator to check the development environment when loading the ICE file. For instance, Device No. = 3A and SE Board No. = 3A are contained in the ICE file assembled using the PD17012 device file. (1) Error message and corresponding action when chip mounted on the SE-17012 and loaded ICE file are not compatible Error message example ? IDI INVALID DEVICE ID NUMBER [xx-] Here, xx in this error message indicates the device number of the actually mounted PD17012 chip and indicates the device number contained in the loaded ICE file. When this error message is output, check the PD17012 chip on the SE board again. If an erroneous chip is mounted, turn the power supply of the in-circuit emulator off once, replace the chip, and load the ICE file again from the beginning. If an incorrect device file was selected during assembly, reassemble the source file using the correct device file and reload that ICE file. (2) Error message and corresponding action when and SE board other than the SE-17012 was mounted and an ICE file other than the PD17012 was loaded Error message example ? ISE INVALID SE BOARD NUMBER [ Here,
-]
in this error message indicates the SE board number of the actually mounted SE board and becomes 3A
indicates the SE board number contained in the loaded ICE file. In the case of the SE-17012, and when the ICE file for the PD17012 is loaded, becomes 3A. If this error message is output, recheck the SE board and the loaded ICE file.
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(3) Action when there is no response from in-circuit emulator * It is possible that the SE-17012 has not been properly mounted on the in-circuit emulator. Remount the SE17012 properly. * It is possible that user's target system and the SE board are not properly connected with the conversion cable and emulation probe (EP-17202GF or EP-17K80GC). Check the connection again. * It is possible that the reset circuit of user's target system is not operating properly. In this case, the SE board might be in an unstable reset status and the IE-17K might not be able to return a response. To determine whether this is indeed the case, install the CE pin pull-up jumper switch, JS4, and restart the incircuit emulator. If any of (1) to (3) above were found, immediately correct the user's target system so that the error message is no longer displayed. 4.6.5 Precautions * When turning the power supply on, first turn on the power supply for the in-circuit emulator and then turn on the power supply for the target system. * Do not use the reset switch (SW1) on the SE-17012. To reset the in-circuit emulator, use the reset switch of the in-circuit emulator.
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4.7 Use of SE Board as Single Unit
4.7.1 Mounting of PROM When the SE-17012 is used as a single unit, install a PROM (the PD27C256AD, PD27C512D or
PD27C1001AD) as the program memory.
A PROM satisfying the following conditions should be installed. * tACC < (Instruction cycle time/4) (tACC: Address setting data output delay time) * PROM size 256 Kb: 512 Kb: 1 Mb:
PD27C256AD-12, -15, -20, and equivalent PD27C512D-12, -15, -20, and equivalent PD27C1001AD-12, -15, -20, and equivalent
It is necessary to write one of the following output files in the PROM in advance as the program. * PROM file (.PRO) for the PD17012 output by the 17K Series assembler (AS17K) * File output for PROM by the .XS0 or .XS1 command of the in-circuit emulator Cautions 1. Do not write the ICE file (.ICE) output by the AS17K to the in-circuit emulator in the PROM. 2. The last address of the PD17012 program memory is 0FFFH. 3. Mount the PD27C256AD, 27C512D, and 27C1001AD aligning the <> marks as shown in Figure 4-14, as the number of pins differs depending on the product.
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Figure 4-14. Notes for Mounting PROM
Removing lever
4.7.2 Setting of ROM/RAM selection slide switch (SW3) The ROM/RAM selection slide switch (SW3) is the switch to set the program memory to be used. Figure 4-15. ROM/RAM Selection Slide Switch (SW3)
ROM SW3 RAM
Remark
The shaded area indicates the selected switch position.
512
1M
PD27C256AD, 27C512D mounting position PD27C1001AD mounting position
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CHAPTER 4 USAGE
4.7.3 Setting of PD27C256AD, PD27C512D, 27C1001AD selection slide switch (SW2) The setting of the slide switch (SW2) depends on which of the PD27C256AD/PD27C512D/27C1001AD is used, as shown in Figure 4-16. Figure 4-16. Setting of PD27C256AD/PD27C512D, 27C1001AD Selection Slide Switch (SW2) (a) When PD27C256AD is used
SW2 256 512 1M
(b) When PD27C512D or 27C1001AD is used
SW2 256 512 1M
Remark
The shaded area indicates the selected switch position.
4.7.4 Supply of power +5 V 5% (VCC) must be supplied to the SE-17012 from an external power supply via the CN11 pin. If the target system uses a power supply voltage other than +5 V, this voltage may be supplied to the PD17012 chip on the SE board via the emulation probe or CN12. For further details, see the descriptions of the PD6706GF level conversion chip and SE board power supply connections in 4.2 Level Conversion Chip (PD6706GF) and 4.3 SE Board Power Supplies, respectively. The LED on the SE-17012 lights if VCC is being supplied correctly. If this LED does not light, the following causes can be considered. * No power is being supplied. * An overcurrent is flowing (more than about 500 mA).
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4.7.5 Program execution Connect the SE-17012 and the target system as shown in Figure 4-17. When the power supply for the target system is turned on, the power is supplied to the SE-17012, the power-on reset works and a program is executed from address 0 of the program written on the PROM. Furthermore, if the reset switch on the SE-17012 is pressed, the system is reset by force and the program written on the PROM is executed from address 0 in the same way as in a power-on reset. Figure 4-17. Example of Connection When SE-17012 Is Used as Single Unit
VCC (+5 V)
PROM SE-17012
Target system
Reset switch (SW1) Conversion cable
Emulation probe
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CHAPTER 4 USAGE
4.8 Monitor Pins
The SE-17012 is provided with monitor pins to monitor the status of the following pins of the PD17012 chip. The monitor pin names and their functions are shown in Table 4-5 and the layout of the monitor pins is shown in Figure 418. Table 4-5. Monitor Pin Names and Functions
Monitor Pin Name Function Monitor Pin Name CH12 CH13 CH14 CH15 CH16 CH17 CH18 CH19 CH20 CH21 CE monitor FMIFC monitor AMIFC monitor F1B1 monitor PIB0 monitor P0C0 monitor P0C1 monitor P1A2 monitor AIN monitor User check monitor Function
CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11
AIB0 monitor AIB1 monitor AIB2 monitor AIB3 monitor DB0 monitor DB1 monitor DB2 monitor DB3 monitor E0 monitor VCOL monitor VCOH monitor
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Figure 4-18. Layout of Monitor Pins
PD17012GF
(Slave)
CH20 CH21
CH1 CH2 CH3 CH4 CH9 CH12 CH15 CH16
CH5 CH6 CH7 CH8
PD17012GF
(Master) Mam'Chip (Gate array)
CH13
CH11
CH14
CH10
CH17 CH18 CH19
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CHAPTER 4 USAGE
4.9 Setting at Shipment
When the SE-17012 is shipped, the crystal resonator, jumper switches and slide switches are set as shown below. (1) Crystal resonator 8 MHz and 4.5 MHz crystal resonators are mounted for the main clock and user clock, respectively. (2) Jumper switches and slide switches These switches are set as shown in the figures in Table 4-6. conditions. Use these switches after checking the set
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Table 4-6. Setting of Jumper Switches and Slide Switches
SW No. JS1
+5 V JS1 VDD1
Jumper SW, Slide SW
Set Conditions
Set Position
Refer to in 4.2 Level Conversion Chip (PD6706GF) and 4.3 SE Board Power Supplies.
JS3
JS3 8K
Do not change the shipment setting.
4K
JS4
JS4
When the CE pin is pulled up
Install
When the CE pin is not pulled up
Remove
SW2
When evaluating with SE-17012 mounted on the in-circuit emulator When evaluating with SE-17012 as single unit When the PD27C256AD is used When the PD27C512D or 27C1001AD is used
Can be set to either the 256 side or the 512 side 256 side
SW2 256
512 1M
512/1M side
SW3
SW3
ROM
RAM
When evaluating with SE-17012 mounted on the in-circuit emulator When evaluating with SE-17012 as single unit When the P0C0 to P0C3 are pulled up
RAM side
ROM side
DSW1
1 2 3 4
ON side
- OFF -
When the P0C0 to P0C3 are not pulled up
OFF side
Remark
The shaded area indicates the setting at shipment.
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CHAPTER 5 CONNECTOR PIN TABLE
Table 5-1. J1 Connector Pin Table
J1 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) GND P1C0 GND P0B0/BEEP0 P0B1/BEEP1 GND GND CE GND P1B1/ADC1 NC GND P0A0/SI1 GND GND P0A2/SCK1 P0B3/FCG1 GND GND NC [10] (9) [18] (16) [12] (11) [16] (14) [7] (7) [21] (19) [20] (18) [26] (23) J1 Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) GND VDD1 P1A0 GND P1A1 GND GND INT P0D1/K1 GND GND P0D3/K3 GND LCD0/KS0/PYA0 LCD1/KS1/PYA1 GND LCD2/KS2/PYA2 GND GND LCD3/KS3/PYA3 [64] (54) [65] (55) [67] (57) [66] (56) [73] (59) [78] (64) [75] (61) [80] (1) [3] (4) [1] (2) J1 Pin No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) LCD4/KS4/PYA4 GND GND LCD5/KS5/PYA5 GND LCD6/KS6/PYA6 LCD8/KS8/PYA8 GND LCD9/KS9/PYA9 GND GND LCD10/KS10/PYA10 LCD12/KS12/PYA12 GND LCD14/KS14/PYA14 LCD13/KS13/PYA13 GND LCD15/KS15/PYA15 LCD11/KS11/PYA11 GND [50] (42) [56] (46) [52] (43) [53] (44) [57] (47) [55] (45) [58] (48) [61] (51) [59] (49) [62] (52) [63] (53)
Remark
The signals VCOL, VCOH, FMIFC, and AMIFC are output from a BNC connector.
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CHAPTER 5 CONNECTOR PIN TABLE
Table 5-2. J2 Connector Pin Table
J2 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) P1C3 P0B2/FCG0 GND P1B0/ADC0 P1C2 GND GND NC GND P1C1 P0A1/SO1 GND VDD2 GND GND NC NC GND GND EO [2] (3) [8, 9] (8) [25] (22) [11] (10) [17] (15) [24] (21) [22] (20) [19] (17) J2 Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) GND NC P1A2 GND P0D0/K0 GND GND P0D2/K2 P0C3 GND GND LCD16/P2E0 GND GND LCD18/P2G0 GND LCD17/P2F0 GND GND COM0 [45] (37) [48] (40) [47] (39) [49] (41) [74] (60) [33] (27) [76] (62) [77] (63) J2 Pin No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Pin Name [Pin No. of 80-Pin PD17012 Chip] (Pin No. of 64-Pin PD17012 Chip) LCD19/P2H0 GND GND COM2 GND P1D1 P0C2 GND P1D3 GND GND P0C1/PWM1 P1D0 GND P1D2 P0C0/PWM0 GND COM1 LCD7/KS7/PYA7 GND [44] (36) [60] (50) [39] (32) [37] (30) [35] (29) [41] (34) [38] (31) [40] (33) [34] (28) [42] (35) [46] (38)
Remark
The signals VCOL, VCOH, FMIFC, and AMIFC are output from a BNC connector.
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
6.1 Package Drawing of Emulation Probe
(1) Probe for 64-pin plastic QFP Part number: EP-17202GF Figure 6-1. Package Drawing of EP-17202GF
19
33 20 32 NEC EP-17202GF
64 52 1
56
44
51
1PIN
7.5 21.5
J1
J2
25.4
84
365 +2 -0
21
Remark
Unit: mm
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(2) Probe for 80-pin plastic QFP Part number: EP-17K80GC Figure 6-2. Package Drawing of EP-17K80GC
80 61 1 61 20 41 21 40 NEC EP-17K80GC
49
1PIN
4.8 11.5
25.4 54 415 21
Remark
Unit: mm
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
6.2 Package Drawing of Conversion Cable
(1) 64GF conversion cable Figure 6-3. Package Drawing of 64GF Conversion Cable
J2 J1 P4 P2 P3 P1
80 80
Remark
Unit: mm
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
(2) 80GF conversion cable Figure 6-4. Package Drawing of 80GC Conversion Cable
P2 P4 P1 P3
J2
J1
44
P2
P1
P4 J2 J1 J4
P3 J3
90
90
Remark
Unit: mm
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
6.3 Package Drawing of Conversion Socket and Recommended Pattern for Board Mounting
(1) EV-9200G-64 and recommended pattern for board mounting Figure 6-5. Package Drawing of EV-9200G-64
F A B G N
S
T D C E U
R
EV-9200G-64-G0E INCHES 0.984 0.799 0.157 0.569 0.748 4-C 0.11 0.031 0.433 0.866 0.972 0.197 0.638 0.744 0.315 0.307 0.098 0.079 0.053 0.014-0.005
+0.004
O
P
EV-9200G-64 1 No.1 pin index Q
H I J
ITEM A B C D E F G H I J K L M N O P Q R S T U
MILLIMETERS 25.0 20.30 4.0 14.45 19.0 4-C 2.8 0.8 11.0 22.0 24.7 5.0 16.2 18.9 8.0 7.8 2.5 2.0 1.35 0.35 0.1
2.3 1.5
0.091 0.059
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K
L
CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
Figure 6-6. Recommended Pattern for Mounting Board of EV-9200G-64
G H
L
E
F
D
J
M
C B A EV-9200G-64-P1E ITEM A B C D E F G H I J K L M MILLIMETERS 25.7 21.0 1.00.02 x 18=18.00.05 INCHES 1.012 0.827 0.039 +0.002 x -0.001 0.709=0.709 +0.002 -0.003
1.00.02 x 12=12.00.05 0.039 +0.002 x 0.472=0.472 +0.003 -0.001 -0.002 15.2 19.9 11.00 0.08 5.50 0.03 5.00 0.08 2.50 0.03 0.6 0.02
2.36 0.03 1.57 0.03
0.598 0.783 0.433 +0.004 -0.003 0.217 +0.001 -0.002 0.197 +0.003 -0.004 0.098 +0.002 -0.001 0.024 +0.001 -0.002
0.093 +0.001 -0.002 0.062 +0.001 -0.002
Caution Dimensions of mount pad for dimensions that for Caution Some of the recommended EV-9200 and of the target device (QFP) may be different in some parts. mount pad for the conversion socket may differ For the recommended mount pad dimensions for from those of the mount pad for the target device. QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). When a device is to be mounted, be sure to also
take the recommended dimensions of the mount pad for the device into consideration when designing.
K
I
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
(2) Package drawing of EV-9500GC-80 and recommended pattern for board mounting Figure 6-7. Package Drawing of EV-9200GC-80
A E B F M N O
R D C S J
K
EV-9200GC-80
1
No.1 pin index
P
G H I EV-9200GC-80-G1E ITEM A B C D E F G H I J K L M N O P Q R S MILLIMETERS 18.0 14.4 14.4 18.0 4-C 2.0 0.8 6.0 16.0 18.7 6.0 16.0 18.7 8.2 8.0 2.5 2.0 0.35
2.3 1.5
Q
INCHES 0.709 0.567 0.567 0.709 4-C 0.079 0.031 0.236 0.63 0.736 0.236 0.63 0.736 0.323 0.315 0.098 0.079 0.014
0.091 0.059
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CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSION CABLE, AND CONVERSION SOCKET
Figure 6-8. Recommended Pattern for Mounting Board of EV-9200GC-80
G
J K
E D F H
L
C B A EV-9200GC-80-P1E ITEM A B C D E F G H I J K L MILLIMETERS 19.7 15.0 0.650.02 x 19=12.350.05 INCHES 0.776 0.591 0.026+0.001 -0.002 x 0.748=0.486 +0.003 -0.002
0.650.02 x 19=12.350.05 0.026 +0.001 x 0.748=0.486 +0.003 -0.002 -0.002 15.0 19.7 6.0 0.05 6.0 0.05 0.35 0.02
2.36 0.03 2.3 1.57 0.03
0.591 0.776 0.236 +0.003 -0.002 0.236 +0.003 0.002 0.014 +0.001 -0.001
+0.001 0.093-0.002
0.091 0.062 +0.001 -0.002
Caution Dimensions of mount pad for EV-9200 and that for Caution Some of the recommended dimensions of the target device (QFP) may be different in some parts. mount recommended mount pad dimensions for For thepad for the conversion socket may differ QFP, refer to of the mount pad for the target device. from those "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"mounted, be sure to also When a device is to be (C10535E).
take the recommended dimensions of the mount pad for the device into consideration when designing.
I
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APPENDIX REVISION HISTORY
Edition 2nd Edition
Major Revised Contents from Previous Version Addition of descriptions of probes, conversion cables, and conversion sockets corresponding to the 80-pin plastic QFP package that is added. Addition of pin numbers of 80-pin plastic QFP package in Table 5-1 J1 Connector Pin Table. Addition of pin numbers of 80-pin plastic QFP package in Table 5-2 J2 Connector Pin Table. Addition of Figure 6-2 Package Drawing of EP-17K80GC. Addition of Figure 6-4 Package Drawing of 80GC Conversion Cable. Addition of Figure 6-7 Package Drawing of EV-9200GC-80. Addition of Figure 6-8 Recommended Pattern for Mounting Board of EV-9200GC-80. Throughout
Location
CHAPTER 5 CONNECTOR PIN TABLE
CHAPTER 6 PACKAGE DRAWING OF EMULATION PROBE, CONVERSIO CABLE, AND CONVERSION SOCKET
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